Team CX1 2.5″ SATA III Solid State Drive 480GB
SKU:
Team 2.5" Std Sata3 CX1 480GB
Team CX1 2.5″ SATA III Solid State Drive 480GB
Team CX2 2.5″ SATA III Solid State Drive 512GB
Team CX2 2.5″ SATA III Solid State Drive 512GB
SKU:
Team CX2 2.5" SATA III Solid State Drive 512GB
TEAM DARK Z RED UD-D4 16GBx2 3200
TEAM DARK Z RED UD-D4 16GBx2 3200
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Tailor made for AMD
- Selected high-quality IC
- OC Profile Support
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM DARK Z RED UD-D4 16GBx2 3200
SKU:
TEAM DARK Z RED UD-D4 16GB*2 3200
TEAM DARK Z RED UD-D4 16GBx2 3200
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Tailor made for AMD
- Selected high-quality IC
- OC Profile Support
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM DARK Z RED UD-D4 16GBx2 3200
TEAM DARK Z RED UD-D4 16GBx2 3200
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Tailor made for AMD
- Selected high-quality IC
- OC Profile Support
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM DARK Z RED UD-D4 8GBx2 3200
TEAM DARK Z RED UD-D4 8GBx2 3200
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM DARK Z RED UD-D4 8GBx2 3200
SKU:
TEAM DARK Z RED UD-D4 8GB*2 3200
TEAM DARK Z RED UD-D4 8GBx2 3200
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM DARK Z RED UD-D4 8GBx2 3600
TEAM DARK Z RED UD-D4 8GBx2 3600
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM DARK Z RED UD-D4 8GBx2 3600
SKU:
TEAM DARK Z RED UD-D4 8GB*2 3600
TEAM DARK Z RED UD-D4 8GBx2 3600
FEATURES
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
TEAM Group T-Force DARK Z GRAY UD-D4 32GBx2 3200
SKU:
TEAM DARK Z GRAY UD-D4 32GB *2 3200
- TEAM Group T-Force DARK Z GRAY UD-D4 32GB *2 3200
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)